Thermosetting resin composition

Details Thermosetting resin composition Thermosetting resin composition

C - Chemistry, Metallurgy

08

G

402/182, 402/216

C08G 73/12 (2006.01) C08F 222/40 (2006.01) C08F 290/02 (2006.01)

Patent

CA 1150444

Abstract of the Disclosure: Disclosed is a thermosetting resin composition comprising (a) a bismaleimide and/or a polymaleimide and (b) at least one member selected from alkenylaniline derivatives, linear dimers thereof, and polymers thereof. In addition to components (a) and (b), this resin composition can contain (c) a polymerizable unsaturated substance.

355840

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