Thermosetting resin composition

Details Thermosetting resin composition Thermosetting resin composition

C - Chemistry, Metallurgy

08

L

400/5047, 400/77

C08L 79/08 (2006.01) C08G 73/10 (2006.01) C08J 5/16 (2006.01) C08K 3/04 (2006.01) C08K 3/30 (2006.01) C08K 3/38 (2006.01) F16C 33/20 (2006.01) F16J 9/28 (2006.01)

Patent

CA 1317056

Abstract A thermosetting resin composition formed of a polyaminobismaleimide resin, which is composed of a bismaleimide compound and a diamine compound, and a solid lubricant. The composition has low coefficient of friction and excellent wear resistance, and can be utilized for self-lubricating parts. The thermosetting resin composition of the instant invention comprises 100 parts by weight of a polyaminobismaleimide resin composed of a bismaleimide compound represented by the following general formula (I): Image (I) wherein R1 means a divalent group of Image or Image , and X denotes a direct bond or a group selected from divalent hydrocarbon group having 1-10 carbon atoms, hexafluorinated isopropylidene group, carbonyl group, thio group, sulfinyl group, sulfonyl group and oxo group, and a diamine compound represented by the following general formula (II): Image (II) wherein R2 means a divalent group of Image or Image , and X denotes a direct bond or a group selected from divalent hydrocarbon group having 1 10 carbon atoms, hexafluorinated isopropylidene group, carbonyl group, thio group, sulfinyl group, sulfonyl group and oxo group; and 5-200 parts by weight of a solid lubricant.

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