Thermosetting resin composition

Details Thermosetting resin composition Thermosetting resin composition

C - Chemistry, Metallurgy

08

G

402/297, 402/33

C08G 73/12 (2006.01) C08F 222/40 (2006.01)

Patent

CA 2028364

ABSTRACT OF THE DISCLOSURE Disclosed is a thermosetting resin composition which comprises a specific bismaleimide compound or polymaleimide and a specific aromatic diamine compound. It can be widely used for electrical and electronic parts, various structural parts, sliding parts and the like.

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