C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
117/196, 400/580
C08L 79/08 (2006.01) C08K 7/10 (2006.01) C08L 63/00 (2006.01) C09D 177/00 (2006.01) H01B 3/30 (2006.01) H01B 3/40 (2006.01) H01B 7/29 (2006.01)
Patent
CA 2002063
THERMOSETTING RESIN COMPOSITION Abstract of the Disclosure A thermosetting resin composition useful for slot insulation purposes is disclosed, which includes: a liquid epoxy resin; a curing agent including an acid anhydride; a maleimide resin in an amount of 3-50 parts by weight per 100 parts by weight of the liquid epoxy resin; and finely divided wollastonite in an amount of 50-400 parts by weight per 100 parts by weight of the liquid epoxy resin.
Akutagawa Ichiro
Fujii Ryuichi
Kamada Naoki
Matsuo Toshio
Matsuzaki Kunimitsu
Hitachi Ltd.
Sim & Mcburney
Somar Corporation
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