Thermosetting resin composition

Details Thermosetting resin composition Thermosetting resin composition

C - Chemistry, Metallurgy

09

D

400/5468

C09D 133/00 (2006.01) C08F 220/34 (2006.01) C08F 220/60 (2006.01) C08F 226/06 (2006.01)

Patent

CA 1115874

THERMOSETTING RESIN COMPOSITION Abstract of the Disclosure: An aqueous solution or dispersion of thermosetting resin comprising a resin, dissolved or dispersed in water in an amount of 5 to 85 % by weight, said resin being obtained by solution polymerization of a mixture comprising (1) at least one polymerizable monomer having an amphoteric ion structure, (2) at least one polymerizable monomer containing a carboxyl group and (3) at least one of other polymerizable monomers in a hydrophilic organic solvent and has a number average molecular weight of 1,000 to 30,000 and a glass transition point of -30 to +80°C. - 1 -

286080

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