Thermosetting resin composition

Details Thermosetting resin composition Thermosetting resin composition

C - Chemistry, Metallurgy

08

G

402/368

C08G 73/12 (2006.01)

Patent

CA 1270998

- 32 - ABSTRACT Thermosetting resin compositions are provided which comprise aromatic bismaleimide derivatives, for example, 2,2-bis[4(3-maleimidephenoxy)phenyl]propane and diamine derivatives, for example, 4,4'-bis(3- aminophenoxy)biphenyl. Prepolymers are also prepared by conducting heat-treatment of said compositions. The compositions of this invention are used for thermo- forming such as compression molding etc. as well as raw materials of adhesives and coatings. The composi- tions provide molded articles which are excellent, for example, in impact strength, flexibility and high- temperature stability.

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