Thermosetting resin composition

Details Thermosetting resin composition Thermosetting resin composition

C - Chemistry, Metallurgy

08

L

400/7703

C08L 79/08 (2006.01) C08G 73/12 (2006.01) C08K 3/14 (2006.01) C08K 3/22 (2006.01) C08K 3/36 (2006.01)

Patent

CA 1326319

Abstract A thermosetting resin composition formed of a polyaminobismaleimide resin, which is prepared from a bismaleimide compound and a diamine compound, and a powdery inorganic filler. The composition has excellent heat resistance as well as superb mechanical properties at high temperature not to mention room temperature, and is expected to find wide-spread commercial utility in electric and electronic components, e.g., as a sealing material in sockets and connectors and for other applications.

565597

Affiliated with

Also associated with

Rating

Thermosetting resin composition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermosetting resin composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermosetting resin composition will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1273976