Thermosetting resin composition

Details Thermosetting resin composition Thermosetting resin composition

C - Chemistry, Metallurgy

08

F

402/253, 400/791

C08F 283/04 (2006.01) C08F 283/00 (2006.01) C08F 283/10 (2006.01) C08G 59/40 (2006.01) C08L 63/00 (2006.01)

Patent

CA 1305582

THERMOSETTING RESIN COMPOSITION ABSTRACT OF THE DISCLOSURE Disclosed is a thermosetting resin composition comprising (a) a preliminary reaction product between a polyamino compound and an unsaturated bismaleimide compound, (b) an epoxy group-containing vinyl compound, (b') a vinyl group-free aliphatic or aromatic halogenated epoxy compound, (c) an epoxy curing agent and (d) a radical polymerization initiator as indispensable components. This composition is characterized in that the vinyl group-free aliphatic or aromatic halogenated epoxy compound as the component (b') is incorporated. This unsaturated bismaleimide type thermosetting resin composition is excellent in not only heat resistance and strength but also flame retardancy and light weight characteristic.

578786

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