C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 61/34 (2006.01) C08J 5/24 (2006.01) C08L 63/02 (2006.01) C08L 63/08 (2006.01) C09K 3/00 (2006.01) H05K 1/03 (2006.01) H05K 3/00 (2006.01)
Patent
CA 2660875
The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a dihydrobenzoxazine ring as a main component, (B) 10 to 25 parts by weight of a polycondensation product of a phenol, a compound having a triazine ring and an aldehyde, and (C) to 45 parts by weight of an epoxy resin, based on 100 parts by weight of the total amount of organic solid components of Components (A), (B) and (C), and (i) a bisphenol F epoxy resin having a weight average molecular weight of 1,000 to 3,000, or (ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular weight of 1,000 to 3,000, is contained in Component (C) in an amount of 0 to 100% by weight of Component (C); and a prepreg, a laminated board for a wiring board and a wiring board using the same.
Abe Norihiro
Aizawa Teruki
Hirai Yasuyuki
Kakitani Minoru
Kamoshida Shinichi
Hitachi Chemical Co. Ltd.
Sim & Mcburney
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