C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
154/126, 402/156
C08G 18/62 (2006.01) C08G 18/09 (2006.01) C08G 18/67 (2006.01) C08G 73/00 (2006.01) C08G 73/10 (2006.01) C08L 75/04 (2006.01) H01B 3/30 (2006.01) H05K 1/03 (2006.01)
Patent
CA 1328528
ABSTRACT OF THE DISCLOSURE A thermosetting resin composition which comprises a cyanate compound or an isocyanate compound represented by the following general formula (I): A - R1 - A (I) wherein R1 is an aromatic group, an alicyclic group or a mixed group thereof and A is a cyanate group or an isocyanate group, and a poly-(p-hydroxystyrene) deriva- tive represented by the following general formula (II): Image (II) wherein X is a fluorine atom, a bromine atom and a chlorine atom, R2 is an alkenyl group and an unsaturated carboxyl group, each having 2 to 4 carbon atoms, B is any one of a polymerization initiator residue, a polymerization-terminating agent residue, H and Image , m is an integer of 1 to 4 and n is an integer of 5 to 100, and further containing a compound having at least one N-substituted unsaturated imido group, if required, can produce a printed circuit board of high flame retardness, low dielectric constant, low moisture absorption and a high mechanical strength at an elevated temperature.
614073
Katagiri Junichi
Nagai Akira
Suzuki Masahiro
Suzuki Masao
Takahashi Akio
Hitachi Ltd.
Hitachi Chemical Company Ltd.
Kirby Eades Gale Baker
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