Thermosetting resin compositions and copper clad laminates...

Details Thermosetting resin compositions and copper clad laminates... Thermosetting resin compositions and copper clad laminates...

H - Electricity

05

K

400/5008, 154/91

H05K 1/03 (2006.01) B32B 15/14 (2006.01) B32B 15/20 (2006.01) B32B 17/04 (2006.01) B32B 27/38 (2006.01) C08G 59/40 (2006.01) C08L 25/18 (2006.01) C08L 63/00 (2006.01) C09D 125/18 (2006.01)

Patent

CA 1025578

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