Thermosetting-resin-forming compositions

Details Thermosetting-resin-forming compositions Thermosetting-resin-forming compositions

C - Chemistry, Metallurgy

08

G

402/219

C08G 73/10 (2006.01) C08F 222/40 (2006.01) C08G 73/12 (2006.01)

Patent

CA 2003664

ABSTRACT This invention provides thermosetting-resin- forming compositions which are formed of (a) a bismaleimide compound represented by the following formula: Image wherein R represents a divalent group of Image or Image , X being a direct bond or a group selected from the group consisting of divalent hydrocarbon groups having 1-10 carbon atoms, hexa-fluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl and oxo, and (b) a specific diallylbisphenol compound. These compositions can provide thermosetting resins having high cracking resistance due to improved impact resistance and toughness and low water absorption.

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