Thermosetting resin glues foamable to high density

Details Thermosetting resin glues foamable to high density Thermosetting resin glues foamable to high density

C - Chemistry, Metallurgy

08

K

403/53

C08K 5/16 (2006.01) C08J 9/00 (2006.01) C08L 61/00 (2006.01) C09J 3/16 (1980.01)

Patent

CA 1141099

ABSTRACT OF THE DISCLOSURE A glue foamable to high density comprises an aqueous alkaline thermosetting resin and a surfactant comprising (1) a fatty acid amide of the alkanol-amines or (2) a tertiary amine oxide used in amount sufficient to render the glue foamable to a stable foam having a density of at least 0.5 and a viscosity of from 1,000 to 20,000 centipoises upon being beaten with air. The glue is useful particu- larly in the manufacture of plywood.

358711

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