Thick film gold metallization composition

Details Thick film gold metallization composition Thick film gold metallization composition

C - Chemistry, Metallurgy

22

C

6/195, 75/66

C22C 5/02 (2006.01) B22F 7/00 (2006.01) C23C 24/10 (2006.01) H01B 1/02 (2006.01) H05K 3/24 (2006.01)

Patent

CA 1216177

TITLE THICK FILM GOLD METALLIZATION COMPOSITION ABSTRACT Paste composition for electrical terminal contact metallization containing 65 to 97% by weight gold and 3 to 25% by weight cadmium/antimony alloy dispersed in an inert liquid vehicle.

441406

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