Thick film heater apparatus

B - Operations – Transporting – 29 – C

Patent

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Details

B29C 45/27 (2006.01) B29C 45/74 (2006.01)

Patent

CA 2413256

Improved injection molding machine heater apparatus using thick-film layers (26, 28, 32) applied directly on a thermally conductive substrate (34) or directly onto the melt channel. Preferably, the substrate (34) is cylindrically shaped with a slot (24) running the length of the substrate (34). The thick film layers (26, 28, 32) and substrate (34) have substantially equal coefficient of thermal expansion. Preferably, the heater assembly has a lower coefficient of thermal expansion than the machine channel it is installed on so as to increase the thermal communication as they heat up. A heat resistant connector housing (36) is slidably installed over the heater assembly (12) for mechanical connection of conductors to the heater without the use of soldering, brazing, welding or other failure prone connection means.

L'invention concerne un appareil chauffant de machine à moulage par injection amélioré, faisant appel à des couches de film épais (26, 28, 32) appliquées directement sur un substrat thermoconductible (34) ou directement dans le filet de la zone de fusion. De préférence, ce substrat (34) est de forme cylindrique et présente une fente (24) sur toute sa longueur. Les couches de film épais (26, 28, 32) et le substrat (34) possèdent un coefficient de dilatation thermique sensiblement égal. De préférence, l'ensemble chauffant possède un coefficient de dilatation thermique plus bas que le canal de la machine sur lequel il est placé, de manière que la communication thermique augmente lorsque ces deux éléments chauffent. Un boîtier de connecteur (36) résistant à la chaleur est placé de manière coulissante sur l'ensemble chauffant (12) pour permettre la liaison mécanique des conducteurs à l'appareil chauffant sans utilisation de brasage tendre, brasage fort, soudage ou d'un autre moyen de connexion sujet à défaillance.

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