Thick film integrated circuits

Details Thick film integrated circuits Thick film integrated circuits

H - Electricity

05

K

356/5

H05K 1/11 (2006.01) H05K 1/16 (2006.01) H05K 1/03 (2006.01) H05K 1/09 (2006.01) H05K 1/18 (2006.01)

Patent

CA 1056955

Abstract of the Disclosure A thick film integrated circuit comprises a ceramic substrate with conductors and printed resistors formed on one or both surfaces. Externally mounted circuit components are mounted on a first substrate surface. On the second substrate surface are formed a conductor for a variable resistor and a printed resistance for the variable resistor. A protective film of negligible resistance is formed on the conductor for the variable resistor. Variable resistor elements including an adjusting shaft and a slider member constituting the variable resistor in cooperation with the printed resistance are mounted on the second substrate surface.

240719

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