H - Electricity – 01 – C
Patent
H - Electricity
01
C
338/25
H01C 17/30 (2006.01) B22F 3/00 (2006.01) H01C 17/28 (2006.01) H05K 1/09 (2006.01) H05K 1/16 (2006.01)
Patent
CA 1159122
Brown, J. F. 3-2 THICK FILM RESISTOR CIRCUITS Abstract of the Disclosure A method of forming thick film resistor circuits whereby non-noble metals requiring a reducing firing atmosphere are included with resistor material requiring an oxidizing atmosphere. The conductor metallization is capable of adhering to the substrate at a low firing temperature in air. The resistors are printed and fired in air after conductor formation. The metal oxide can then be reduced at a sufficiently low temperature so as not to significantly affect the resistor material. In one embodiment, the conductor paste includes copper and glass frits which can adhere to a ceramic substrate by firing at a temperature of less than 1100 degrees C.
378151
Brown John F.
Stanton Robert M.
Kirby Eades Gale Baker
Western Electric Company Incorporated
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