Thickener composition

C - Chemistry – Metallurgy – 09 – K

Patent

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Details

C09K 8/035 (2006.01) B01J 19/06 (2006.01) C10M 171/00 (2006.01) C11D 1/00 (2006.01) E21B 21/14 (2006.01) E21B 43/25 (2006.01)

Patent

CA 2669627

The present invention relates to a thickener system which is suitable for preparing a thickener composition and consists of (A) at least one anionic surfactant A and (B) at least one polymer B which comprises at least one hydrophobic group and at least one hydrophilic group, the concentration of the polymer B in the thickener composition being below the overlap concentration c* of the polymer, to the use of an inventive thickener system for preparing a thickener composition, to a thickener composition comprising an inventive thickener system and to the use of inventive thickener compositions.

La présente invention concerne un système épaississant qui convient à la préparation d'une composition épaississante et consiste en (A) au moins un tensioactif anionique A et (B) au moins un polymère B qui comprend au moins un groupement hydrophobe et au moins un groupement hydrophile, la concentration du polymère B dans la composition épaississante étant inférieure à la concentration de recouvrement c* du polymère. L'invention concerne également l'utilisation du système épaississant selon l'invention pour la préparation d'une composition épaississante, une composition épaississante comprenant le système épaississant selon l'invention et l'utilisation des compositions épaississantes selon l'invention.

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