C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 83/04 (2006.01) C08K 3/00 (2006.01) C08K 3/22 (2006.01) C09J 183/04 (2006.01) H01L 23/00 (2006.01)
Patent
CA 2536803
Thermal interface compositions (20) contain filler particles possessing a maximum particle size less than 25 microns in diameter blended with a polymer matrix. Such compositions enable lower attainable bond line thickness, which decreases in-situ thermal resistances that exist between thermal interface materials (20) and the corresponding mating surfaces.
L'invention concerne des compositions d'interface thermique (20) qui contiennent des particules de charge possédant un diamètre de particule maximum inférieur à 25 µm mélangées à une matrice polymère. Ces compositions permettent de réduire l'épaisseur du plan de joint réalisable, ce qui réduit les résistances thermiques in situ existant entre les matières d'interface thermique (20) et les surfaces de contact correspondantes.
David Jennifer Lynn
Elser David Richard
Gowda Arun Virupaksha
Prabhakumar Ananth
Saville Kimberly Marie
Company General Electric
Craig Wilson And Company
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