Thin film adhering method and thin film adhering apparatus

H - Electricity – 05 – K

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

154/30.1, 154/72

H05K 3/00 (2006.01) B32B 31/10 (1990.01) B32B 31/18 (1990.01)

Patent

CA 1294201

ABSTRACT OF THE DISCLOSURE A thin film adhering apparatus and method in which a thin film whose length corresponds to that of a substrate is adhered to the substrate by applying pressure using a pressure adhering roller. The apparatus includes a substrate conveyance mechanism for conveying the substrate to a thin film adhering position and conveying the substrate from that position; a thin film feeding member for suctioning the leading edge portion of the continuous thin film and supplying the leading edge portion to the adhering position; a leading edge portion holding member having a holding side which comes into surface contact with the leading edge portion of the thin film, the holding side having suction holes communicating with a vacuum suction system for suctioning the leading edge portion of the film, the continuous thin film held in the thin film adhering position by the holding member being adhered to the thin film adhering side of the substrate from the leading edge portion of the film and the substrate to the trailing edge portion thereof by the pressure adhering roller; and a cutter for cutting the continuous thin film at the trailing edge portion thereof to the length corresponding to that of the base.

612531

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Thin film adhering method and thin film adhering apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thin film adhering method and thin film adhering apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin film adhering method and thin film adhering apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1325193

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.