H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 1/16 (2006.01) H05B 33/12 (2006.01)
Patent
CA 2537998
The invention relates to a thin-film assembly (1) comprising a substrate (2) and at least one electronic thin-film component (8) that has been applied to the substrate using thin-film technology. The substrate is equipped with a base electrode (4) that is provided with thin-film layers that form part of the thin-film component (8), in addition to an upper top electrode (9). The substrate (2) is configured as a printed circuit board that is known per se, comprising an insulation material base body (3) and a metal lining that acts as a conductor layer (5), the latter (5) forming the base electrode (4) and being polished for this purpose at least at the location of the thin-film component (8). A contact layer (18), created by thin-film technology, is provided between the polished, optionally reinforced conductor layer (5) and the thin-film layers of the thin-film component (8) that lie above said conductor layer, said contact layer being physically or chemically adsorbed on the surface of the base electrode (4).
L'invention concerne un ensemble à couches minces (1) comportant un substrat (2) et au moins un composant électronique à couches minces (8) appliqué sur le substrat selon la technique des couches minces. Sur le substrat se trouve une électrode de base (4) sur laquelle sont formées des couches minces, y compris une électrode de recouvrement supérieure (9), faisant partie du composant à couches minces (8); le substrat (2) est formé par une carte de circuits connue en soi, comportant un corps de base en matériau isolant (3) et une doublure métallique servant de couche conductrice (5). Cette dernière forme l'électrode de base (4) et est polie à cet effet au moins à l'emplacement du composant à couches minces (8). Entre la couche conductrice (5) polie, éventuellement renforcée, et les couches minces du composant (8), situées au-dessus de cette dernière, se trouve une couche de contact (18) réalisée selon la technique des couches minces, qui est adsorbée par voie physique ou chimique sur la surface de l'électrode de base (4).
Frosch Ronald
Haslebner Nikolai
Leising Guenther
Riedler Manfred
Wuchse Markus
At & S. Austria Technologie & Systemtechnik Aktiengesellschaft
Bereskin & Parr Llp/s.e.n.c.r.l.,s.r.l.
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