Thin film bonding apparatus having adjustable film cutoff unit

B - Operations – Transporting – 32 – B

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154/1

B32B 37/22 (2006.01) B26D 1/38 (2006.01) B26D 5/04 (2006.01) H05K 3/00 (2006.01)

Patent

CA 2018222

ABSTRACT OF THE DISCLOSURE A thin film bonding apparatus which is operative to bond a continuous thin film to the surface of a base plate, using heat and pressure applied by a pressure bonding roller, and to cut the film to a length corresponding to that of the base plate. The apparatus has an adjustable film cut-off unit having a fixed cutter and a rotary cutter, both of which extend across the width of the thin film, transverse to the direction of continuous film feed. The fixed cutter and the rotary cutter are independently supported by members which are movable and convey the respective cutters into and out of a film cutting position. The support members are movable manually, to permit initial insertion of the thin film into a cutoff position, and automatically during continuous operation of the thin film bonding apparatus.

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