Thin film bonding method and apparatus having structure for...

Details Thin film bonding method and apparatus having structure for... Thin film bonding method and apparatus having structure for...

H - Electricity

05

K

154/40

H05K 3/46 (2006.01) B32B 37/22 (2006.01) G03F 7/16 (2006.01) H05K 3/00 (2006.01)

Patent

CA 2015516

ABSTRACT OF THE DISCLOSURE A thin film bonding method and apparatus having structure for removing wetting agents applied to a thin film and base plate that are to be bonded by pressure and heat. A spray or rollers apply the wetting agent prior to the initial bonding of a leading edge of the thin film to a leading edge of the base plate. A pressure roller applies heat and pressure to the film and base plate, bonding them together as the roller rotates and drives the plate toward a cleaning position. Suction and agent removal rollers are used to remove the residual excess agent from the bonded film and the pressure roller. The removal rollers are joined together by a link mechanism that has a spring bias and is operation by a gear mechanism that provides a wiping action.

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