Thin film metal package for lsi chips

Details Thin film metal package for lsi chips Thin film metal package for lsi chips

H - Electricity

05

K

356/8

H05K 1/18 (2006.01) H01L 23/14 (2006.01) H01L 23/538 (2006.01) H05K 3/46 (2006.01) H05K 1/11 (2006.01)

Patent

CA 1139009

THIN FILM METAL PACKAGE FOR LSI CHIPS ABSTRACT An integrated circuit board for mounting very high density chips of small size on its top surface in- cluding conductor planes for carrying very large values of .DELTA.I (transient current) is constructed with a plurality of essentially flat parallel power planes serving as conductive leads to the chip connectors (pins or solder balls). The land areas on the top surface of the board are connected to conductors below by integrated coaxial conductor extensions from the planes having a high degree of capacitive coupling to adjacent conductor planes. YO978-065

353720

Affiliated with

Also associated with

Rating

Thin film metal package for lsi chips does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thin film metal package for lsi chips, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin film metal package for lsi chips will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-309890