Thin film sputtering with angular orientation of emission...

B - Operations – Transporting – 05 – D

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204/96.09

B05D 3/06 (2006.01) C23C 14/00 (2006.01) C23C 14/04 (2006.01) C23C 14/34 (2006.01) C23C 14/22 (2006.01)

Patent

CA 1283886

ABSTRACT OF THE DISCLOSURES The present invention resides in an apparatus and method for applying a thin film by sputtering to a film-receiving surface of a workpiece, said apparatus including means defining a process chamber, a deposition source having an emission surface arranged within the process chamber at a first location therein, sputtering means for sputtering film forming material from said emission surface, and means at a second location within the process chamber for mounting a workpiece having a film-receiving surface for rotation relative to the deposition source, characterized in that said emission surface and said film-receiving surface are disposed in respective vertical planes arranged at an angle in the range of about 10 to 45 degrees, said angle defined between an imaginary line perpendicular to the emission surface of the deposition source and an imaginary line perpendicular to the film-receiving surface of the work- piece when the workpiece is mounted by said mounting means.

517826

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