B - Operations – Transporting – 23 – D
Patent
B - Operations, Transporting
23
D
B23D 23/00 (2006.01) B23D 47/04 (2006.01) B27C 5/00 (2006.01) B27D 1/10 (2006.01) B27G 11/00 (2006.01) B27M 1/08 (2006.01)
Patent
CA 2108197
A thin plate cutting/jointing apparatus includes a cutting apparatus for pressing the front end of a following thin plate and the rear end of a preceding thin plate together and cutting the pressed front and rear ends of the thin plates in stepped scarf shapes; an adhesive coating apparatus for coating an adhesive on the cut surface of the end portions of the thin plates; and a jointing apparatus for pushing the thin plates coated with the adhesive against each other and vertically pressing them, so as to jointing the end portions of the thin plates.
Dispositif permettant de couper et assembler des plaques minces. Il comprend un dispositif de coupe pour presser ensemble l'extrémité avant de la plaque mince suivante et l'extrémité arrière de la plaque mince précédente et couper les extrémités avant et arrière des plaques minces pressées ensemble en forme de joint à gradin; dispositif permettant d'étendre une couche adhésive sur la surface taillée des extrémités des plaques minces, et dispositif d'assemblage pour pousser les plaques minces enduites de l'adhésif l'une contre l'autre et les presser verticalement, de manière à assembler les extrémités des plaques minces.
Minami Machine Co. Ltd.
Robic
LandOfFree
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