Three-dimensional circuit component assembly and method...

H - Electricity – 05 – K

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H05K 7/02 (2006.01) H05K 1/18 (2006.01) H05K 1/14 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2033081

2033081 9015478 PCTABS00002 A plurality of plate-like circuit component carrier packages (71) are stacked adjacent one to another with the flat faces (72, 74) thereof in contact to form a carrier package assembly (40). Each carrier package houses one or more electrical circuit component (110) coupled to electrical contacts (84, 86) on the flat faces and electrical contacts (98) or upstanding pins (424, 436) on the sides. These cooperate with those of adjacent carrier packages to electrically interconnect with the circuit components therein. A flexible, printed circuit board (50) having an array of contact sites (52) selectively interconnected by printed routing traces (54) is wrapped around the carrier package assembly. The ends of the carrier package assembly are fitted with supporting and electrically interconnecting connector blocks (22, 16). Plural carrier package assemblies are interconnectable directly, by nesting, or through intermediate connecting structures.

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