Three dimensional molded sockets for mechanical and...

H - Electricity – 05 – K

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

H05K 1/18 (2006.01) H05K 1/11 (2006.01) H05K 3/28 (2006.01)

Patent

CA 2284072

There is disclosed herein an electrical circuit assembly which requires no solder processing, comprising an electronic component (10) having terminations (14) arranged on at least one of its surfaces, and a moulded curviplanar substrate (20) having circuit traces (30) thereon and a cavity (24) formed therein, wherein the cavity (24) substantially conforms in shape with the electronic component (10). Proximate the cavity (24) is a plurality of electrical contacts (40), arranged in matched relation with the respective terminations (14) of the electronic component (10), with at least one of the electrical contacts (40) being connected to at least one of the circuit traces (30) on the substrate (20). The cavity (24) and electrical contacts (40) are dimensioned such that an interference fit is provided between the component's terminations and the electrical contacts, such that the component (10) is held within the cavity (24) when the component (10) is placed therein. The component (10) is disposed in the cavity (24) such that its terminations (14) are in physical and electrical connection with their respective electrical contacts (40).

L'invention concerne un ensemble circuit électrique ne nécessitant aucun brasage, comprenant un composant électronique (10) dont les terminaisons (14) sont disposées sur au moins une de ces surfaces, et un substrat (20) à plan courbe, moulé, sur lequel se trouvent des pistes de circuit (30) et dans lequel est formée une cavité (24) dont la forme correspond pratiquement à la forme du composant électronique (10). A proximité de la cavité (24) se trouve une pluralité de contacts électriques (40) disposés de façon à être appariés avec les terminaisons (14) respectives du composant électronique (10), au moins un de ces contacts électriques (40) étant connecté à au moins une des pistes de circuit (30) du substrat (20). La cavité (24) et les contacts électriques (40) ont une dimension telle qu'on obtient un ajustement serré entre les terminaisons du composant et les contacts électriques, de sorte que le composant (10) est retenu dans la cavité (24) après sa mise en place dans celle-ci. Ledit composant (10) est placé dans la cavité (24) de sorte que ses terminaisons (14) soient en contact physique et électrique avec leur contact électrique (40) respectif.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Three dimensional molded sockets for mechanical and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Three dimensional molded sockets for mechanical and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Three dimensional molded sockets for mechanical and... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1497853

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.