Three dimensional package for monolithic...

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Details

H01L 25/065 (2006.01) H01L 23/66 (2006.01) H05K 1/02 (2006.01) H05K 1/18 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2160242

A three-dimensional interconnect package is provided for monolithic microwave/millimeterwave integrated circuits. A mating substrate for receiving an MMIC has transmission lips disposed over its surfaces. The mating substrate mounted substantially vertical in a base substrate which also has transmission lines for carrying microwave/millimeterwave signals. The transmission lips on both substrates are put in electrical contact and microwave/millimeterwave signals are transmitted between the substrates with a minimum of signal loss or reflection.

L'invention concerne un module tridimensionnel conçu pour des circuits intégrés monolithiques à micro-ondes/ondes millimétriques. Un substrat de connexion servant à recevoir un MMIC possède des lignes de transmission qui sont disposées au-dessus de ses surfaces. Le substrat est monté pratiquement verticalement dans un substrat de base possédant également des lignes de transmission servant à transporter des signaux de micro-ondes/ondes millimétriques. Les lignes de transmission sur les deux substrats sont mises en contact électrique et des signaux de micro-ondes/ondes millimétriques sont transmis entre les substrats avec un minimum de perte ou de réflexion de signal.

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