Three dimensional packaging and cooling of mixed signal,...

Details Three dimensional packaging and cooling of mixed signal,... Three dimensional packaging and cooling of mixed signal,...

H - Electricity

05

K

H05K 7/20 (2006.01)

Patent

CA 2554793

An integrated three dimensional packaging and cooling system for cooling an electronic component system with dissimilar power densities and interfering signals.

L'invention concerne un système de refroidissement et de conditionnement tridimensionnel intégré, destiné au refroidissement d'un système de composants électroniques avec des signaux brouilleurs et des densités de puissance dissemblables.

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