H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/12, 356/22
H05K 1/02 (2006.01) G03F 1/00 (2006.01) H05K 3/00 (2006.01) H05K 1/00 (2006.01)
Patent
CA 2036818
60LT01067 ABSTRACT In a process for plating or etching metalization patterns on the surface of a three dimensional substrate, a flexible plastic mask is fabricated by first coating the surface of a thin plastic sheet with vacuum formable ink. The mask is then molded into the shape of the surface into which the pattern is to be formed. A low power YAG laser is used to remove areas of the ink through which light is to be allowed to pass. This mask may then be used in either a print and plate process or a print and etch process by drawing the mask into intimate contact with the workpiece by applying a vacuum between the mask and the workpiece. The workpiece may then be exposed to light through the clear areas of the mask.
Johnson William Lloyd
Mettler John Herbert
Strickland William Charles
Zaderej Victor Vasyl
Craig Wilson And Company
Mint-Pac Technologies Inc.
LandOfFree
Three dimensional plating or etching process and masks therefor does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Three dimensional plating or etching process and masks therefor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Three dimensional plating or etching process and masks therefor will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1991525