H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/1
H05K 1/02 (2006.01) H05K 1/00 (2006.01) H05K 1/18 (2006.01) H05K 3/00 (2006.01)
Patent
CA 1303235
20365-2958 ABSTRACT OF THE DISCLOSURE A three-dimensional printed circuit board having at least two rigid board sections capable of being arranged in different planes and flexibly connected by connecting sections between adjacent board sections is manufactured as a one-piece injection molded part of a thermoplastic molding material. The flexible connecting sections are fashioned as thin regions hav- ing a thickness less than the thickness of the rigid board sec- tions. When a semi-crystalline or liquid-crystalline thermo- plastic molding material is used, the connecting sections are formed as flexible film hinges, whereas an amorphous thermo- plastic molding material results in the connecting sections being bendable only under the influence of heat.
611161
Bednarz Juergen
Rauchmaul Siegfried
Schmidt Hans-Fr
Aktiengesellschaft Siemens
Bednarz Juergen
Fetherstonhaugh & Co.
Rauchmaul Siegfried
Schmidt Hans-Fr
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