Three-dimensional processor using transferred thin film...

Details Three-dimensional processor using transferred thin film... Three-dimensional processor using transferred thin film...

H - Electricity

01

L

H01L 25/18 (2006.01) H01L 21/98 (2006.01) H01L 23/498 (2006.01) H01L 25/065 (2006.01)

Patent

CA 2173123

A multi-layered structure is fabricated in which a microprocessor is configured in different layers and interconnected vertically through insulating layers which separate each circuit layer of the structure. Each circuit layer can be fabricated in a separate wafer or thin film material and then transferred onto the layered structure and interconnected.

Dans une structure multi-couche, un microprocesseur, est configuré en couches différentes et interconnecté verticalement au travers de couches d'isolation qui séparent toutes les couches de circuit de cette structure. Chaque couche de circuit peut prendre la forme d'une plaquette ou d'un matériau à couche mince séparé qui est alors tranféré sur la structure multi-couche et interconnecté.

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