Through substrate annular via including plug filler

Details Through substrate annular via including plug filler Through substrate annular via including plug filler

H - Electricity

01

L

H01L 23/48 (2006.01) H01L 21/768 (2006.01)

Patent

CA 2708207

A through substrate (10) via includes an annular conductor layer at a periphery of a through substrate (10) aperture, and a plug layer (24) surrounded by the annular conductor layer. A method for fabricating the through substrate (10) via includes forming a blind aperture within a substrate (10) and successively forming and subsequently planarizing within the blind aperture a conformal conductor layer (20) that does not fill the aperture and plug layer (24) that does fill the aperture. The backside of the substrate (10) may then be planarized to expose at least the planarized conformal conductor layer. (20)

L'invention porte sur un trou d'interconnexion traversant le substrat (10) qui comprend une couche conductrice annulaire au niveau de la périphérie d'une ouverture traversant le substrat (10), et une couche de bouchon (24) entourée par la couche conductrice annulaire. L'invention porte également sur un procédé de fabrication du trou d'interconnexion traversant le substrat (10), qui comprend la création d'une ouverture aveugle à l'intérieur d'un substrat (10) et successivement la création et la planarisation ultérieure à l'intérieur de l'ouverture aveugle d'une couche conductrice conforme (20) qui ne remplit pas l'ouverture et d'une couche de bouchon (24) qui remplit effectivement l'ouverture. Le côté arrière du substrat (10) peut ensuite être planarisé pour exposer au moins la couche conductrice conforme planarisée (20).

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