Tie layer and method for forming thermoplastics

B - Operations – Transporting – 29 – C

Patent

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Details

B29C 70/86 (2006.01) B05B 1/24 (2006.01) B29C 41/20 (2006.01) B29C 41/22 (2006.01) B29C 43/18 (2006.01) B29C 70/78 (2006.01) B32B 7/12 (2006.01) C08J 7/06 (2006.01)

Patent

CA 2593781

A tie layer for bonding a ceramic or metallic coating to a thermoplastic substrate is described. The tie layer comprises from 2 to 70% ceramic and/or metallic filler particles in a thermoplastic matrix. The thermoplastic matrix is compatible with the thermoplastic substrate. Further, a method of bonding a ceramic or metallic coating to a thermoplastic substrate is disclosed. The method involves applying the tie layer to the substrate, and bonding the ceramic or metallic coating to the tie layer using a coating process that consolidates the substrate, the tie layer and the coating. The tie layer and process are useful in coating implantable prosthetic bones, or coating industrial items used in automotive, aeronautical or medical industries.

Couche de liaison permettant de lier un revêtement céramique ou métallique à un substrat thermoplastique. La couche de liaison comprend entre 2 et 70 % de particules de remplissage céramiques et/ou métalliques dans une matrice thermoplastique, laquelle matrice est compatible avec le substrat thermoplastique. Un procédé de liaison de revêtement céramique ou métallique à un substrat thermoplastique implique l'application de la couche de liaison sur le substrat et la liaison du revêtement céramique ou métallique sur la couche de liaison au moyen d'un procédé de revêtement qui consolide de le substrat, la couche de liaison et le revêtement. La couche de liaison et le procédé sont utilisés dans le revêtement d'os prothétiques implantables ou dans le revêtement d'articles industriels utilisés dans les industries automobile, aéronautique ou médicale.

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