C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
204/27.5
C25D 3/56 (2006.01)
Patent
CA 1333377
The invention comprises an article of manufacture comprising at least one printed wireboard (PWB) with at least one conductive surface, having a tin-bismuth alloy deposited on at least a portion of the surface, the alloy being deposited from an electroplating bath comprising bismuth and tin ion in aqueous solution, wherein the bismuth and the tin ion are present in the bath in amounts sufficient to deposit the tin-bismuth alloy onto the conductive surface of the PWB in a weight ratio relative to each other selected to provide a controlled bismuth content of the tin-bismuth alloy on the conductive surface of the PWB in an amount of greater than about 10 wt.% bismuth, the bath having an electrolyte comprising at least one alkyl sulfonic acid or salt thereof in an amount sufficient to inhibit hydrolytic precipitation of the bismuth ion.
579850
Atochem North America Inc.
Atofina Chemicals Inc.
Fetherstonhaugh & Co.
Wilson Harold P.
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