Tin bismuth solder paste, and method using paste to form...

Details Tin bismuth solder paste, and method using paste to form... Tin bismuth solder paste, and method using paste to form...

B - Operations, Transporting

23

K

B23K 35/34 (2006.01) B23K 35/02 (2006.01) B23K 35/24 (2006.01) B23K 35/26 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2140253

A solder paste (24 in Fig. 1) of the type utilized in forming a solder connection (32 in Fig. 2) for a microelectronic package comprises a mixture of compositionally distinct metal powders. The paste comprises a first metal powder formed of tin-bismuth solder alloy. The paste further comprises a second metal powder containing gold or silver. During reflow, the gold or silver alloys with the tin-bismuth solder to increase the melting part and enhance mechanical properties of the product connection.

Une pâte à souder (24 dans la fig. 1) du type utilisé dans une connexion de soudure (32 dans la fig. 2) pour un ensemble micro-électronique comprend un mélange de poudres de métaux distinctes sur le plan de la composition. La pâte est constituée d'une première poudre de métal formée d'un alliage de soudure étain-bismuth et d'une seconde poudre de métal contenant de l'or ou de l'argent. Pendant la refusion, l'or ou l'argent s'allie avec l'étain et le bismuth pour augmenter la partie en fusion et ainsi améliorer les propriétés mécaniques de la soudure du produit.

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