Tin-gold electroplating bath and process

Details Tin-gold electroplating bath and process Tin-gold electroplating bath and process

C - Chemistry, Metallurgy

25

D

204/27.5

C25D 3/56 (2006.01) C25D 3/60 (2006.01) C25D 3/62 (2006.01)

Patent

CA 1075191

TIN-GOLD ELECTROPLATING BATH AND PROCESS ABSTRACT OF THE DISCLOSURE Disclosed is an aqueous electroplating bath suitable for plating a tin gold alloy and a process of plating employing that bath. The bath contains gold as the auricyanide complex and tin as a stannic halide complex. The bath is operated at a pH value not in excess of 3. Where desired, the bath also contains a brightener. The electroplating bath is extremely stable and produces high quality electrodeposits.

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