C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
204/27.5
C25D 3/56 (2006.01) C25D 3/60 (2006.01) C25D 3/62 (2006.01)
Patent
CA 1075191
TIN-GOLD ELECTROPLATING BATH AND PROCESS ABSTRACT OF THE DISCLOSURE Disclosed is an aqueous electroplating bath suitable for plating a tin gold alloy and a process of plating employing that bath. The bath contains gold as the auricyanide complex and tin as a stannic halide complex. The bath is operated at a pH value not in excess of 3. Where desired, the bath also contains a brightener. The electroplating bath is extremely stable and produces high quality electrodeposits.
267802
Deuber John M.
Rosikiewicz Kathleen R.
Stevens Peter
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