Tin/lead plating bath and method

Details Tin/lead plating bath and method Tin/lead plating bath and method

C - Chemistry, Metallurgy

25

D

204/27.5

C25D 3/56 (2006.01) C25D 3/32 (2006.01) C25D 3/36 (2006.01)

Patent

CA 1122560

Abstract of the Disclosure A plating bath for electrodeposition of tin/lead alloys contains stannous ion, lead ion, a fluoborate, fluosilicate or sulfamate radical and, as a brightener system, a nonionic poly- oxyalkylated surfactant, a lower aliphatic aldehyde, an amine and a cyclic brightener selected from the group consisting of aromatic aldehydes, heterocyclic carboxaldehydes, aromatic ketones and carboxylic acids, the pH of the bath being less than about 3Ø

125760

Affiliated with

Also associated with

Rating

Tin/lead plating bath and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Tin/lead plating bath and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tin/lead plating bath and method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-938982