Tin plating electrolyte compositions

Details Tin plating electrolyte compositions Tin plating electrolyte compositions

C - Chemistry, Metallurgy

25

D

C25D 3/32 (2006.01) C25D 7/06 (2006.01)

Patent

CA 2234152

There is disclosed a composition suitable for use in a process for electroplating surfaces with tin, comprising: a) one or more acids selected from sulphuric acid, sulphamic acid, aryl sulphonic acids, alkyl sulphonic acids and alkanol sulphonic acids, b) one or more addition agents comprising a mono-, di- or tri-substituted phenol (each optionally alkyoxylated) or a mixture of two or more such compounds, in which at least one of the substituents includes a secondary, tertiary or quaternary nitrogen atom, c) a tin source and d) water. There is also disclosed a method of tin plating using the composition of this invention.

L'invention concerne une composition utile dans un procédé d'étamage électrolytique et comprenant: a) un ou plusieurs acides sélectionnés parmi l'acide sulfurique, l'acide sulfamique, les acides arylsulfoniques, les acides sulfoniques alkylés et les acides alcanolsulfoniques, b) un ou plusieurs agents d'addition comprenant un phénol mono-, di- ou trisubstitué (chacun éventuellement alkyoxylé) ou un mélange de deux ou plusieurs de ces composés, dans lesquels au moins un des substituants possède un atome d'azote secondaire, tertiaire ou quaternaire, c) une source d'étain et d) de l'eau. L'invention concerne également un procédé d'étamage dans lequel cette composition est utilisée.

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