Tin-zinc lead-free solder and solder-joined part

Details Tin-zinc lead-free solder and solder-joined part Tin-zinc lead-free solder and solder-joined part

B - Operations, Transporting

23

K

B23K 35/26 (2006.01) B23K 35/02 (2006.01) B23K 35/36 (2006.01)

Patent

CA 2466948

A tin-zinc lead-free solder contains tin as a main component, at least 6-10 weight% of zinc essentially, 0.0015 to 0.03 weight% of magnesium, and 0.0010 to 0.006 weight% of aluminum. When a paste of the solder is stored in a cooled state or even at temperatures above the room temperature, the oxide protective film formed from magnesium and aluminum on solder particles protects the inside, the shelf life is prolonged by suppressing the reaction between the zinc and an activator, a favorable wettability can be maintained because the oxide protective film is subject to breakage when the solder is heated and melted.

L'invention concerne un alliage de brasage étain-zinc sans plomb, cet alliage contenant de l'étain comme composant principal, essentiellement au moins 6 à 10 % en poids de zinc, 0,0015 à 0,03 % en poids de magnésium, et 0,0010 à 0,006 % en poids d'aluminium. Lors du stockage d'une pâte formée de cet alliage dans un état froid ou bien même à des températures supérieures à l'ambiante, un film protecteur d'oxyde composé de magnésium et d'aluminium et recouvrant les particules de l'alliage en protège l'intérieur, le temps de conservation étant prolongé par la suppression de la réaction entre le zinc et un promoteur. Ce film protecteur pouvant rompre lorsque l'alliage de brasage est chauffé et fondu, la mouillabilité favorable est conservée.

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