Tin-zinc lead-free solder, its mixture, and solder-joined part

B - Operations – Transporting – 23 – K

Patent

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Details

B23K 35/14 (2006.01) B23K 35/02 (2006.01) B23K 35/26 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2466949

A tin-zinc lead-free solder contains tin as a main component and essentially at least 6-10 weight% of zinc. A protective film of magnesium oxide is formed on the surface of the solder. The solder also contains 0.0015 to 0.1 weight% of magnesium, at which percentage the oxide protective film can be broken when the solder is melted. While a paste of this solder is stored, the magnesium oxide protective film formed on the solder particles protects the inside of the solder particles and suppresses the reaction between the zinc and an activator to prolong the shelf life. The oxide protective film is subject to breakage when the solder is heated and melted to maintain the favorable wettability.

L'invention concerne un alliage de brasage étain-zinc sans plomb, cet alliage contenant de l'étain comme composant principal et essentiellement au moins 6 à 10 % en poids de zinc. Un film protecteur d'oxyde de magnésium recouvre la surface de cet alliage. Cet alliage de brasage contient également 0,0015 à 0,1 % en poids de magnésium, pourcentage pour lequel le film protecteur peut rompre lorsque l'alliage fond. Lors du stockage d'une pâte formée de cet alliage, le film protecteur d'oxyde de magnésium formé sur les particules de l'alliage protège l'intérieur des particules et empêche la réaction entre le zinc et un promoteur pour prolonger le temps de conservation. Ledit film protecteur peut rompre lorsque l'alliage est chauffé et fondu pour conserver une mouillabilité favorable.

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