Tire mold

Details Tire mold Tire mold

B - Operations, Transporting

29

C

18/167

B29C 35/00 (2006.01) B29C 33/02 (2006.01) B29D 30/06 (2006.01)

Patent

CA 1277814

ABSTRACT OF THE DISCLOSURE Disclosed is a tire mold for curing pneumatic tires wherein the mold includes a mold back, a tread ring and an insulator plate located between the mold back and the tread ring. The insulator plate is made of material that has a lower thermal conductivity than the thermal conductivity of the material in the mold back or tread ring. The addition of the insulator plate between the mold back and the tread ring induces reduction in heat transfer between the mold back and the tread ring allowing the maintenance of higher heat transfer for areas of the tire not shielded by the insulator plate and achieving the lower heat transfer in the area of the tire shielded by the insulator plate.

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