Transceiver stacked assembly

Details Transceiver stacked assembly Transceiver stacked assembly

H - Electricity

04

B

H04B 1/38 (2006.01) H04B 1/03 (2006.01) H04B 1/52 (2006.01) H05K 9/00 (2006.01)

Patent

CA 2334367

A transceiver (100) comprises a stacked metal laminate assembly of a plurality of layers (104-112) inside an enclosure (102). A first layer (104) forms an antenna. A second layer (106) forms a ground plane for the antenna. A third layer (108) forms "front-end" filters (duplexer). A fourth layer (110) together with the second layer forms an electromagnetic isolation enclosure for the filters. A fifth layer (112) comprises a PC board with electronic circuits of the transceiver mounted thereon, and is both mounted to and electronically shielded by the fourth layer. Each of the first through fourth layers is preferably made from a single metal layer, such as a sheet of metal, by stamping. Each of the first through fourth layers is either bent along its periphery into a substantially "cake-pan" shape, or is flat and has a separate side wall (130) attached thereto. Flanges (122 and 124) that are unitarily formed with the filters extend through orifices (126 and 128) in the second and fourth layers to connect the filters with the antenna and the electronic circuits. The connections may be conductive or capacitive. The assembly is put together by stacking the first through fourth layers and then epoxying, soldering, or welding them together.

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