Transducer backing material and method of application

Details Transducer backing material and method of application Transducer backing material and method of application

H - Electricity

04

R

H04R 17/00 (2006.01) G10K 11/16 (2006.01)

Patent

CA 2330920

A transducer backing material includes a sticky epoxy resin containing tungsten particles and silver particles. A method of applying a backing material to a transducer includes pouring a mixture of epoxy resin, tungsten particles, and silver particles into a mold containing a layer of piezoelectric material, degassing the mixture, and curing the mixture at a pressure of approximately one atmosphere until the mixture dries.

L'invention concerne un matériau de fond de transducteur qui contient une résine époxyde collante comprenant des particules de tungstène et d'argent. Selon l'invention, un procédé d'application d'un matériau de fond consiste à verser le mélange de résine époxyde et de particules de tungstène et d'argent dans un récipient de moulage contenant une couche de matériau piézo-électrique, à dégazer le mélange et à le faire durcir sous une pression d'environ une atmosphère, jusqu'à ce que le mélange sèche.

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