H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/12, 154/40,
H05K 3/10 (2006.01) B30B 5/02 (2006.01) B30B 11/00 (2006.01) H05K 3/20 (2006.01) H05K 1/00 (2006.01) H05K 1/09 (2006.01) H05K 3/38 (2006.01)
Patent
CA 2031519
2031519 9012683 PCTABS00002 This invention relates to an apparatus and method for uniformly transmitting pressure to laminate a conductor or printed circuit to an at least two-dimensional substrate surface so that the bonding of one to the other is uniform across the surface including the periphery of the surface. The invention includes multiple platens disposed opposite each other. One platen contains a cavity for insertion of a substantial thickness of the substrate while the other platen has attached to it a cylinder having portions of its volume divided by multiple diaphragms. One of the diaphragms is a mold shaped to be a mirror image of the surface of the substrate, and which is confined in the distal end of the cylinder. An alternative embodiment is directed to the use of a bellows attached to the noted platen in place of the cylinder. The bellows has at its distal end the mentioned mold. This technique permits not only a uniform lamination technique, but also provides a technique for eliminating the hazard of using a bladder with hot pressurized fluid which can burst or jet fluid at personnel.
Salensky George A.
Thoman Thomas S.
Amoco Corporation
Gowling Lafleur Henderson Llp
Salensky George A.
Thoman Thomas S.
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