Transient eutectic phase process for ceramic-metal bonding,...

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B23K 31/02 (2006.01) B23K 35/00 (2006.01) B23K 35/36 (2006.01) C04B 35/10 (2006.01) B23K 35/30 (2006.01) B23K 35/38 (2006.01)

Patent

CA 2444664

A method for directly joining ceramics (10) and metals (12). The method involves forming a structure having a ceramic component (10), a more refractory metallic component and a less refractory metallic-material-based interlayer (14) disposed between the ceramic component (10) and the metallic component (12); adding a eutectic forming reactant to the metallic interlayer (14); and heating the structure to approximately a eutectic melting temperature of the reactant and the interlayer to form a metallic-material- based eutectic liquid that interacts with the metallic component to form a bond that directly joins the ceramic and metallic components to one another.

La présente invention concerne un procédé destiné à lier directement des céramiques (10) et des métaux (12). Ce procédé consiste à former une structure possédant un composant (10) céramique, un composant métallique plus réfractaire et une intercouche (14) à base de matériau métallique moins réfractaire placée entre le composant (10) céramique et le composant (12) métallique, à ajouter un réactif de formage eutectique à l'intercouche (14) métallique et à chauffer la structure à une température de fusion eutectique approximative du réactif et de l'intercouche de façon à former un liquide eutectique à base de matériau métallique qui interagit avec le composant métallique afin de former une liaison qui lie directement entre eux les composants céramique et métallique

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