Transparent epoxy structures

H - Electricity – 01 – F

Patent

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Details

H01F 27/02 (2006.01) B29C 39/00 (2006.01) B29C 39/42 (2006.01) B29C 71/02 (2006.01) B29D 22/00 (2006.01) F41G 1/00 (2006.01) H01F 27/12 (2006.01) H01F 41/00 (2006.01) B29C 35/08 (2006.01)

Patent

CA 2397570

A cured filler-less epoxy compound formed as a rigid, three-dimensional, transparent structure, including a cylindrical sight bowl (10) of a utility or industrial high voltage bushing (15). A process for making a three-dimensional (e.g., cylindrical), transparent structure with improved strength, including the steps of obtaining a cured filler-less epoxy compound and then pre- stressing the filler-less epoxy compound.

Composé époxydique sans charge durci façonné sous forme d'une structure rigide, tridimensionnelle, transparente comprenant un cylindre transparent (10) pour une enveloppe haute tension (15) employée dans une traversée haute tension utilisée dans l'industrie ou dans d'autres secteurs. Un procédé de fabrication d'une structure transparente tridimensionnelle (cylindrique par exemple) plus résistante, comprend les étapes suivantes à savoir la préparation d'un composé époxydique sans charge durci suivie de la précontrainte du composé époxydique sans charge.

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