Transponder embedded in a flexible multi-layer support

Details Transponder embedded in a flexible multi-layer support Transponder embedded in a flexible multi-layer support

H - Electricity

04

B

H04B 1/59 (2006.01) H01L 23/02 (2006.01) H01Q 1/22 (2006.01) H01Q 1/27 (2006.01) H05K 1/18 (2006.01)

Patent

CA 2606079

The transponder with an electronic unit comprising an antenna coil (4) connected to a chip module (5) embedded in a multi-layer laminate support (1) comprises at least one flexible thermoplastic layer (2) disposed on both sides of the electronic unit wherein the multi-layer laminate support further comprises a non-woven foil (3) with a grammage of less than 25 g/m2.

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