Treating multilayer printed wiring boards

Details Treating multilayer printed wiring boards Treating multilayer printed wiring boards

C - Chemistry, Metallurgy

23

F

204/96.05

C23F 4/00 (2006.01) B01J 19/08 (2006.01) C08J 3/28 (2006.01) H01J 37/32 (2006.01) H05K 3/00 (2006.01)

Patent

CA 1128896

BARTLET 1/2 -13- TREATING MULTILAYER PRINTED WIRING BOARDS Abstract of the Disclosure Multilayer printed wiring boards are conventionally laminated using epoxy adhesives. When the boards are drilled, a residual smear often remains within the drilled holes. This smear prevents proper through plating of the holes and the layers are left without some of the intended interconnections. In the past, the residual smear was removed by wet etching. A technique is described using plasma etching with the conductive surface layers of the drilled boards as the electrodes to generate the plasma. The plasma forms directly within the holes and effectively removes the smear. A dielectric material in contact or close proximity to the perimeter of each board provides uniformity of treatment over the panels.

350377

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